- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 27/06 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
Patent holdings for IPC class H01L 27/06
Total number of patents in this class: 6919
10-year publication summary
699
|
738
|
695
|
731
|
748
|
703
|
574
|
590
|
562
|
164
|
2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Taiwan Semiconductor Manufacturing Company, Ltd. | 36809 |
692 |
Semiconductor Energy Laboratory Co., Ltd. | 10902 |
520 |
Fuji Electric Co., Ltd. | 4750 |
314 |
International Business Machines Corporation | 60644 |
234 |
Texas Instruments Incorporated | 19376 |
201 |
Samsung Electronics Co., Ltd. | 131630 |
195 |
Micron Technology, Inc. | 24960 |
193 |
Intel Corporation | 45621 |
170 |
Renesas Electronics Corporation | 6305 |
151 |
Rohm Co., Ltd. | 5843 |
145 |
GLOBALFOUNDRIES U.S. Inc. | 6459 |
139 |
Mitsubishi Electric Corporation | 43934 |
135 |
Monolithic 3D Inc. | 270 |
135 |
Qualcomm Incorporated | 76576 |
131 |
Infineon Technologies AG | 8189 |
112 |
Denso Corporation | 23338 |
100 |
Semiconductor Components Industries, L.L.C. | 5345 |
91 |
Infineon Technologies Austria AG | 1954 |
88 |
Toshiba Corporation | 12017 |
83 |
Sony Semiconductor Solutions Corporation | 8770 |
78 |
Other owners | 3012 |